Abstract
The installation of components in a row-wise arrangement on a printed circuit board (PCB) is a common occurrence in current switch design. However, with the increasing power dissipation of such components the use of heat sinks becomes necessary. Techniques are presented herein that support a new heat sink fixture design which handles components that are installed in a row. Aspects of the presented techniques consume a minimal amount of PCB area, support the use of a phase-change material (PCM), and are circuit trace friendly.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Lu, Troy; Liu, Gavin; Lin, Kayen; and Zhang, Guoyin, "HEAT SINK FIXTURE DESIGNS FOR ROW-BASED COMPONENTS PROVIDING ENHANCED THERMAL PERFORMANCE", Technical Disclosure Commons, (June 14, 2023)
https://www.tdcommons.org/dpubs_series/5979