This disclosure describes a hybrid lidded multi-chip package that includes a non-continuous lid that is matched to corresponding thermal requirements of different chips in the package. Per techniques of this disclosure, selected portions of the chip package where cooling requirements can be met when lidded include a lid, whereas portions of the chip package that require additional cooling that may be hampered by a lid do not include a lid. Portions requiring additional cooling utilize the opening in the lid design that enables the chip to be directly in contact with a heat sink (cold plate) and a second thermal interface material. Suitable modifications are provided in the cold plate pedestal design to accommodate variable depths in the chip package. Different thermal interface materials that are tailored to the thermal requirements at different chip locations are utilized. Described configurations can provide a combination of superior thermal performance and reliability.
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N/A, "Hybrid Lidded Multi-Chip Package", Technical Disclosure Commons, (October 05, 2020)