In high-power application-specific integrated circuits (ASICs), multiple voltage regulator ICs are required on the package to provide the required power to the ASIC. These underfill components on package are not reworkable and manufacturing flaws cannot be fixed, thus having a negative impact on the overall package yield. A system and method are proposed here to increase the package yield on ASICs by placing redundant voltage regulator ICs in addition to the multiple voltage regulator ICs operating in parallel on a semiconductor package. The redundancy ensures that the overall system in the package would be functional even with certain limited flawed ICs, which are then disabled. This method increases the cumulative assembly yield, with relatively small increase in cost and size. Furthermore, they allow a degree of freedom in the die size and power rating selection of voltage regulator ICs.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Sizikov, Gregory; Kwon, Woon Seong; Li, Xin; Jiang, Shuai; and Ying, Lung-Yang, "Method And Apparatus For Improved Cumulative Yield Of On-Package Voltage Regulator Assembly", Technical Disclosure Commons, (December 12, 2016)