HP INCFollow

Abstract

In the area of printed circuit assembly manufacturing a process called strain gage testing is used.

This process is used to confirm that strain sensitive devices mounted on a ridged printed circuit

board (PCB) will not be exposed to excessive forces. Excessive forces may result in printed

circuit board deflection or deflection at an excessive rate. When stiff body part packages cannot

comply with the printed circuit board deflection stress is exerted on the solder joints often

resulting in failures.

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