Abstract
This disclosure could be used to read internal information using thermal
properties of the parts.
Creative Commons License
This work is licensed under a Creative Commons Attribution-Share Alike 4.0 License.
Recommended Citation
INC, HP, "READING HIDDEN META-INFORMATION USING THERMAL TECHNOLOGY", Technical Disclosure Commons, (February 07, 2020)
https://www.tdcommons.org/dpubs_series/2938
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