Inventor(s)

HP INCFollow

Abstract

This disclosure relates to the field of leveling of 3D printing machines, where structures need to be

leveled over irregular floors. If some cases, printer’s structure will not provide sufficient structural

stiffness to constrain printer’s deformations within an admissible range, thus a leveling process that

corrects this eventual lack of flatness will be required. Commonly used leveling procedures may be

based either on geometrical condition measurements of specific printer’s structural components or

spatial position determination of printer’s reference points, this last one typically using laser tracker

instrumentation. These processes are typically either tedious or require the use of expensive

equipment.

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