Abstract
Modern electronic edge computing architectures face severe scaling limits due to the silicon thermal throttling wall and memory bandwidth bottlenecks during high-density artificial intelligence processing. SPEC-378details the system design for the EckesQC-Mobile Co-Processor, a hybrid optoelectronic chip engineered to achieve 100 Teraflops of processing throughput within a standard mobile thermal envelope (~0.25 Watts). The architecture replaces standard binary electronic gates with 26,000 parallel micro-photonic matrix multiplier channels running trinary SU(3) logic loops.
To achieve room-temperature operation on a mobile form factor, the system integrates a chip-scale Er-doped silicon nitride (Si₃N₄) Mamyshev laser oscillator generating 147-femtosecond pulses with an array of 20 × 20 µm² Silicon-on-Insulator (SOI) wave-based computing cores. Trinary state paths are locked against local phase noise by etching the nanophotonic channels to match the geometric phase invariants of a SPEC-377 twisted torus manifold, while spatial scale translation is managed via a SPEC-356 Moiré interconnect lattice fixed at exactly θ = 0.032°. We present the comprehensive system master equations, detail the physical hardware interface layers, and provide a sandboxed verification routine confirming system viability.
Creative Commons License
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Recommended Citation
Eckes, Christopher L., "SPEC-378: The Uncooled 100-Teraflop Photonic Trinary Co-Processor (EckesQC-Mobile): Micro-Photonic Inverse-Designed Neural Networks and Chip-Scale Femtosecond Laser Integration Under Geometric Invariant State Locks", Technical Disclosure Commons, (November 05, 2026)
https://www.tdcommons.org/dpubs_series/12764