Abstract
A method for fabricating and integrating micro-light-emitting diode based optical input/output chiplets utilizes a reconstructed wafer architecture to combine heterogeneous semiconductor dies prior to wafer-level assembly. Known good photodetector dies and micro-light-emitting diode transmitter dies are arranged facing upward on a temporary carrier wafer, and die-to-die gaps are filled with a dielectric oxide material. Sequential redistribution layers are formed over the reconstructed wafer to establish a power distribution network along with a surface hybrid bonding layer. The reconstructed wafer is then bonded face-to-face to a complementary metal-oxide-semiconductor base wafer in a single wafer-to-wafer hybrid bonding step. Backside processing is performed simultaneously across the photodetector and transmitter dies, including substrate removal, formation of thru-dielectric vias, application of anti-reflective coatings, and attachment of a micro-lens array for optical coupling. This architecture accommodates differing source wafer dimensions, enhances photodetector substrate utilization, enables pre-integration screening, and reduces total bonding interfaces.
Keywords: micro-LED, optical I/O chiplet, heterogeneous integration, reconstructed wafer, die-to-wafer hybrid bonding, power distribution network, thru-dielectric via, micro-lens array, TPU, GPU, ASIC.
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Recommended Citation
N/A and , "Method For Heterogeneous Integration And Fabrication Of Micro-Led Based Optical Input/Output Chiplets", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/12385