Abstract
A mechanical support arrangement is proposed herein for reducing laser-diode warpage during attachment to a substrate. Mechanical standoffs positioned around a solder pad beneath the laser diode support the diode during placement and while solder freezes, helping the diode remain flat during and after the attachment process. The standoffs can be located along edges of the diode or across its length or width and can be implemented through modifications to existing support structures. Reduced deformation is expected to provide superior laser spectral characteristics.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Bovington, Jock T.; Hovey, Steve; Isaienko, Oleksandr; Mack, Michael P.; and Gloeckner, Steffen, "MECHANICAL STANDOFF TO CONTROL DIE WARPAGE", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/12262