Abstract
A system for controlled debonding can utilize a multi-stage, software-assisted process. For example, a release procedure may be initiated through a software interface, which can arm a subordinate control module and may start a security timer. The system can then utilize one or more integrated sensors to detect an event, such as the physical opening of the device's enclosure. Upon detection, the control module can actuate a circuit to deliver a controlled electrical current to an electrically-releasable adhesive layer, which can weaken its bond. This approach may simplify component removal and can reduce the risk of damage associated with some manual removal techniques, potentially improving device serviceability.
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Recommended Citation
Pelosi, AleX, "System for Controlled Debonding of a Component Using Software Arming and Enclosure Sensing", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/11916