Abstract
A vertical power delivery structure supplies power for high-current-density applications, such as accelerator application-specific integrated circuits (ASICs). The inductor structure within the vertical power delivery structure uses a four-phase trans-inductor voltage regulation (TLVR) inductor that is physically separated into two distinct two-phase inductor halves. A solid copper structure fills the gap between these two halves, mechanically bonding them into a single, free-standing component. The copper filler electrically shields the inductor halves from each other, reducing crosstalk when the two halves are assigned to different power rails. The filler also provides a direct ground-return path for the power stage and forms a thermal conduction path to channel heat from the printed circuit board under the inductor structure to the printed circuit board above the inductor structure. This structure improves the power integrity, thermal performance, and manufacturability of the vertical power module.
Keywords: vertical power delivery inductor structure, crosstalk shielding, thermal performance, power performance, 4-phase TLVR inductor, copper ground-return path, machine learning accelerator, vertical power module, power integrity
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
N/A, "Vertical Power Delivery Inductor Structure with Copper Ground-Return Path for Crosstalk and Thermal Management", Technical Disclosure Commons, (September 23, 2026)
https://www.tdcommons.org/dpubs_series/11840