Abstract
CCVTE‑3.x is an upgraded chip‑scale thermal engine integrating micro‑vortex conditioning, Diamond/I‑WP TPMS hotspot suppression, graded Diamond→Gyroid transitions, micro‑restrictor flow balancing, and micro‑bypass hydraulic stabilization. It is designed for direct‑die cooling, chiplet cooling, microfluidics, and semiconductor hotspot management.
This invention incorporates improvements derived from prior Caldwell inventions including UGCRM‑2.0, Mechanic’s Battery v3.0, GCI #259‑B, Arachne v9.0, and CVGTC‑2.x. All geometry is scaled to chip‑level dimensions and is fully manufacturable using CNC micromachining, micro‑EDM, or SLM metal printing.
CCVTE‑3.x provides measurable improvements in hotspot suppression, thermal resistance, pump efficiency, boundary‑layer disruption, and transient thermal stability.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Caldwell, Michael Victor Mr., "CALDWELL CHIP‑SCALE VORTEX‑TPMS THERMAL ENGINE (CCVTE‑3.x) Open‑Hardware • No Patents • No Secrets • Builder‑Ready", Technical Disclosure Commons, ()
https://www.tdcommons.org/dpubs_series/11595