Abstract

CIERS‑TEG v3.0 is an open‑hardware, research‑grade thermal‑energy recovery architecture designed for high‑density compute environments such as AI GPU clusters, power‑electronics arrays, and industrial process lines. The system captures waste heat at the chip level, routes it through a controlled thermal cascade, and converts portions of that heat into electrical power, stored thermal energy, and useful low‑grade utilities. Unlike single‑stage thermoelectric approaches, CIERS‑TEG v3.0 maintains exergy across multiple descending temperature stages using microfluidic extraction, gyroid thermal spreading, phase‑change buffering, condensation‑based utility recovery, and parasitic pump‑energy harvesting.

The architecture integrates several previously independent open‑hardware subsystems: Arachne‑Chip ULTRA‑REAL for direct‑die microfluidic heat capture; UGCRM‑1.0 for uniform gyroid thermal spreading; a modular TEG array for selective high‑ΔT electrical generation; Forgecell Prime for transient thermal buffering; Phoenix‑Water for low‑grade condensation and utility heat; TEHL‑v1.0 for vortex‑induced vibration (VIV) parasitic energy recovery; and GCI #259 for cold‑side pre‑cooling. A supervisory control layer (CIERS/CICIS) coordinates sensors from FDMS, TST‑1.0, and MMRA to maximize net recovered exergy while maintaining safe chip temperatures and stable flow conditions.

CIERS‑TEG v3.0 is fully buildable as a laboratory prototype. The disclosure provides complete CAD geometry, BOM, fluid and electrical schematics, firmware, and a four‑phase experimental protocol enabling researchers to measure interface thermal resistance, net TEG power, PCM buffering performance, parasitic‑energy recovery, and full‑system exergy over extended operation. The system is intended as a practical research platform for evaluating multi‑stage waste‑heat utilization in modern compute environments, enabling facility‑level improvements in heat capture, cooling efficiency, and useful thermal deployment.

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This work is licensed under a Creative Commons Attribution 4.0 License.

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