Abstract

The Forgecell Prime 2.0 is a physical, buildable Active Thermal Buffering and Gradient Stabilization Platform. It eliminates thermal drift, suppresses gradient collapse, and maintains a uniform thermal envelope for sensitive multi-physics instruments (MMRA-2.0, FDMS-1.0, VABR-2.0) by combining Phase Change Material (PCM) passive buffering with active Thermoelectric Cooler (TEC) arrays controlled by an FPGA.

In engineering terms, "Thermal-Buffering Reinforcement" is implemented as a Hybrid Thermal Management System:

  1. Passive Layer: A high-latent-heat PCM (e.g., paraffin/salt hydrate composite) surrounding the payload absorbs transient heat spikes, preventing rapid temperature changes.

  2. Active Layer: A multi-zone TEC array, driven by an FPGA-based PID controller, actively heats or cools the PCM boundary to maintain a precise setpoint (±0.05°C stability), compensating for ambient drift and internal heat generation.

This document provides the exact specifications, Bill of Materials (BOM), mechanical designs, and FPGA control logic to construct a prototype that achieves <0.2°C thermal drift, >90% gradient suppression, and ±0.05°C steady-state stability, compatible with biomedical and aerospace sensor payloads.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.

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