Abstract
The transition of a room-temperature quantum computing architecture from a collection of mathematical models to a scalable, physical computer requires a repeatable chemical and mechanical manufacturing framework. This disclosure specifies a standalone Dual-Phase Centrifugal Sedimentation Protocol and cleanroom factory recipe. The specification provides the exact parameters needed to deposit, laminar-flow, and permanently seal a fluidic lipid bilayer substrate inside the sub-micron interconnect tracks of a self-assembled Hexagonal Close-Packed (HCP) inverse opal matrix.
Traditional solid-state fabrication techniques cannot form fluidic quantum boundaries; they induce surface roughness, structural voids, and gas trapping that cause premature phase scattering. This module resolves the lamination crisis by employing high-velocity centrifugal forces balanced against precise thermal and pressure profiles. By infiltrating dipalmitoylphosphatidylcholine (DPPC) lipids mixed with molecular cholesterol stabilizers at a strict 1:4 molar ratio, the recipe uniformly coats internal channels without micro-fracturing the underlying fused silica (SiO₂) skeleton. This chemical engineering specification delivers a self-healing, hermetically sealed fluidic lamination framework capable of long-term, low-friction operation under standard atmospheric conditions.
Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Eckes, Christopher L., "Technical Disclosure Specification: Module 1 Dual-Phase Centrifugal Sedimentation Protocols and Capillary Infiltration Recipes for the Monolithic Manufacturing and Fluidic Lamination of Multiblock Quantum Metamaterials", Technical Disclosure Commons, (July 28, 2026)
https://www.tdcommons.org/dpubs_series/11169