Abstract
This disclosure describes a thermally interchangeable enhanced busbar for data center use. The busbar addresses the problem of having to proportionally scale the physical size (and weight) of a busbar in order to support increased appliance power demands while still meeting original temperature and safety requirements. The thermally interchangeable enhanced busbar described herein allows for more space within an appliance rack to be allocated to the appliances themselves and enables the opportunity for higher performing rack appliances. The thermal interface of the busbar is a thermally conductive but electrically insulative component. It can span the entire length of the busbar or can be subdivided into smaller sections that attach to the busbar in specific and focused areas. In the use case of smaller sections, separate individual thermal interface sections can differ in size, thickness, and material composition.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
NA, "Thermally Interchangeable Enhanced Busbar", Technical Disclosure Commons, (November 22, 2024)
https://www.tdcommons.org/dpubs_series/7588