Abstract
The present disclosure relates to cooling of networking components, optics, and Printed Circuit Boards (PCBs) via embedded Liquid Cooled (LC) copper slugs or pipes. Multiple smaller, strategically placed slugs can help extract heat at the PCB level, maintaining a cooler and more evenly cooled PCB. Larger or component specific slugs can be placed under or near components to extract heat out directly from the multiple components. This reduces cooling cost as one slug can remove heat from multiple devices and does not hinder PCB rework as LC slugs are embedded into the PCB and do not cover or prevent access to surrounding components.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Anonymous, "Cooling Components, Optics, and Printed Circuit Boards via Embedded Liquid Cooled Copper Slugs or Pipes", Technical Disclosure Commons, (October 17, 2024)
https://www.tdcommons.org/dpubs_series/7444