Abstract
This disclosure describes a thermal pad that provides high thermal efficiency when affixed to a heat source in electronic components. The thermal pad is pre-shaped into a dome (spherically or contoured) shape that is thicker at the center and thinner at the perimeter. The thermal pad includes a curved (dome shaped) surface. When clamping forces are applied during assembly, a surface of the thermal pad comes into contact with a surface of the heat source, first at the center of the contact area, and then over a progressively greater surface area. The gradual coverage of the surface area, starting at the center of the heat source, prevents or reduces air entrapment between the surface of the thermal pad and the heat source. The reduced air entrapment can enable greater thermal efficiency and superior thermal performance. The thermal pad can be formed into the specially shaped surface by using a die-forming tool, post-forming using a forming tool, during solidification of a thermal pad, or by removal of excess material from a thermal pad.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
n/a, "Thermal Pads with Curved Surface for Improved Thermal Efficiency", Technical Disclosure Commons, (September 14, 2024)
https://www.tdcommons.org/dpubs_series/7357