Abstract
The present disclosure relates to a dual component non-hermetic heatsinking lid. Components are divided to move the assembly tolerance stack-up between the slug and lid while minimizing the impacts of thermal performance. A non-hermetic lid (A) serves as a heatsink for an Integrated Circuit (IC) flipped chip (D). A secondary slug type component (B) serves as a direct thermal interface between the IC chip (D) and the outside of the device. The segmentation of both components A and B allows the buffer interface thickness (2) to be separate from the lid bond line (3) and the critical thermal interface (1) while minimizing the thermal impact of the buffer.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
Anonymous, "Dual component non-hermetic heatsinking lid", Technical Disclosure Commons, (August 30, 2024)
https://www.tdcommons.org/dpubs_series/7318