Abstract
By avoiding full melting in the thermoforming process in applications where the parts are acting only as a positive volume dimensional performance of the resultant parts is improved.
Creative Commons License
This work is licensed under a Creative Commons Attribution-Share Alike 4.0 License.
Recommended Citation
INC, HP, "Porous Positive Molds for Thermoforming Applications", Technical Disclosure Commons, (July 15, 2024)
https://www.tdcommons.org/dpubs_series/7193
COinS