HP INCFollow


The external threat of ESD/EOS event to the IT products is disturbing the manufacturer. In most of cases, manufacturer has no idea from where the ESD/EOS event enter the product to damage to the unit.

The proposed idea is to deploy ESD sensors on specific areas of the IT product like I/O ports, keyboard, click pad, buttons, openings of housing, power rails, signal pins to collect the ESD/EOS event. Except for collecting event count, location, we can also collect the event timing length to evaluate the strength of energy, identifying it is ESD (below 100ns) or EOS (above 100ns) event.

The proposed idea deploys copper foils as sensors on user frequent contact areas where ESD/EOS is possible enter into the system like I/O ports, openings of housing, buttons, top chassis, bottom chassis. The circuit behind the sensors will collect the ESD/EOS event for positive voltage and negative voltage. Sensor circuit will deliver a signal to EC when there is EOS/ESD event. EC will operate to record the event for timing length and the location of ESD/EOS occurrence.

After ESD/EOS event, in system level we will run a subsystem (commodities) sanity check according to the reported area for margin change. If the margin becomes worse, it needs to inform user & ITDM to act for the issue. It would be saved in the cloud database as well for further insight capture, including where is the hot spot in particular NB sku, which IO/power rail is easier attacked, and how many counts attack in the user site. These insights will help ITDM to take action to prevent potential risk and extend NB lifecycle.

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