In the field of semiconductor packaging, wire-shifting may occur during the molding process of manufacturing TMV (Through Mold Via) formed by wire bonding technology. The wire-shifting will cause deviations of the external electrical connection ends of the wires. This disclosure describes a high-accuracy molding method. More specifically, the method uses a restriction structure at the mold chase for the molding process, so as to control the wire-shifting. Further, the restriction structure also has a guiding effect on the wires, and therefore improving the success rate of the manufacturing because the wires are accommodated in the restriction structure.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.