In the field of semiconductor packaging, wire-shifting may occur during the molding process of manufacturing TMV (Through Mold Via) formed by wire bonding technology. The wire-shifting will cause deviations of the external electrical connection ends of the wires. This disclosure describes a high-accuracy molding method. More specifically, the method uses a restriction structure at the mold chase for the molding process, so as to control the wire-shifting. Further, the restriction structure also has a guiding effect on the wires, and therefore improving the success rate of the manufacturing because the wires are accommodated in the restriction structure.
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Advanced Semiconductor Engineering, Inc., "High-Accuracy Molding to Expose Wires for System-in-Packages or Modules", Technical Disclosure Commons, (September 08, 2023)