This disclosure describes techniques for providing voltage management functionality in a silicon interposer included in an integrated circuit (chip) package. Per techniques of this disclosure, the silicon interposer is utilized for voltage regulation, in addition to providing electrical routing to the package. The interposer includes a voltage regulator module (VRM) that can convert the supply voltage to other voltage levels that can be utilized by different chips in the integrated circuit (IC) package. Switching logic is included within the interposer. Since many packages have similar power specifications, the interposer designs can be reused across different chip designs. A lower impedance can be attained since the distance between the VRM sensor and load is reduced, thereby enabling faster response times. The described techniques can enable fewer power pads and a lower power requirement, providing better efficiency and thermal performance. Unused rails can be powered down for additional power savings.

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Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.