This invention shortens the return path through extra ground vias leading to a smaller loop of the return path and removes resonance completely. High-speed signal differential vias of top side connectors and bottom side connectors are in opposite directions which reduces the crosstalk between vias and makes the design implementable with a lesser number of PCB layers. This invention matches the signal impedance closest to the required 100Ω±10% impedance. There is no dependency on PCB layer stack-up, so the concept can be used across different platforms. This invention can be utilized for speeds beyond 56G PAM4 both in single sided and in belly-to-belly configurations.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.