HP INCFollow


Current chipsets of notebooks and laptops do not have the capability to track refurbishment or remanufacturing status of the notebook under the operating system, i.e., at the silicon chip layer. PC manufacturers can design a notebook PC to be refurbished and/or remanufactured to extend the life the PC and/or resell the PC as a second life device (or with follow-on refurbishment services, as a 3rd, 4th, etc. life device) with specific tracking information to determine if and when the PC had been refurbished, if any incidents have occurred to the PC, and to track if any components within the PC had been replaced or repaired.

The PC can be designed with a refurbishment counter and unique id, e.g., Unique Platform ID (UPID) record embedded and starting at time of manufacture and securely update the counter whenever a certified refurbishment service has occurred subsequently. This innovation allows for the PC manufacture to create and maintain a permanent “VIN-like” record (an identifier associated and unique to the specific PC) secured at the silicon chip layer in the PC. This innovation also allows for the creation and maintenance of a “CarFax-like” record of certain incidents, thresholds exceeded, and repaired/replaced components have been performed during the lifetime of the PC.

The telemetry recorded includes data such as a refurb counter (e.g., the times the PC has been refurbished or remanufactured), intrusion detection (e.g., the times a PC has been opened for repair or upgrading), shock incidents (e.g., the times a PC has been dropped), thermal incidents (e.g., exceeding specified temperature thresholds) and similar telemetry. The telemetry stored and maintained below the operating system layer, at the silicon chip layer, provides a more secure, persistent, permanent and reliable record as opposed to storing the telemetry at or above the operating system and software layer which can be altered, deleted or lost by reimaging the storage device of the PC.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution-Share Alike 4.0 License.