For a printed circuit board (PCB) that includes many high-speed differential pairs may be routed the signal integrity (SI) performance of the pairs is to be carefully considered. One factor that may lead to a poorer SI performance, on the PCB itself and within a ball grid array (BGA) that is mounted on the PCB, is the glass-weave effect. To mitigate the impact of the glass-weave effect inside of a BGA, techniques are presented herein that support rotating the BGA by a free angle. With such a BGA rotation, a pair's traces will be rotated by the same angle and, consequently, the glass-weave effect on those traces can be mitigated.
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Ji, Yongchao; Fu, Greg; Yang, Siyuan; Liu, Jun; Hu, MengJie; and Yu, Maofei, "MITIGATING THE GLASS-WEAVE EFFECT INSIDE A BGA", Technical Disclosure Commons, (June 22, 2023)