This disclosure describes techniques for mitigation of warpage and improvement of soldering yield and solder joint shape consistency in ball grid arrays (BGAs) in printed circuit board assembly (PCBA) process. An added free weight is placed on the BGA package before it enters a solder reflow process. Standoffs are provided on the surface of the PCB. To prevent damage to the die and/or internal structure of the package, a suitable weight is selected. A support fixture is provided at the base to prevent the PCB from sagging due to the extra weight. Solder joint formation can be adjusted by adjusting the height of the spacer and/or the applied solder paste volume. Techniques of this disclosure can be applied to a rigid and/or flex PCB assembly (PCBA) manufacturing process.
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n/a, "Improved Ball Grid Array Solder Joints", Technical Disclosure Commons, (November 04, 2022)