This disclosure describes an L-shaped stiffener for ball grid array (BGA) devices. The stiffener can enable devices that can meet thermal requirements and mechanical reliability requirements without requiring a large package size. The stiffener enables direct exposure of the die to cooling solutions while also reducing warpage without increasing the package size of the BGA device. The stiffener package includes a copper lid that leaves the main processor ASIC on a substrate exposed to the cooling solution and either fully or partially covers other silicon chips mounted on the substrate. A thermal interface material layer is disposed between the other silicon chips and the lid to enable heat transfer. The cavity above the ASIC created by the stiffener ensures that there is no thermal resistance between the ASIC and a cold plate. The stiffener can provide suitable degrees of coverage of the chip(s) depending on the thermal requirements and warpage constraints of a particular use case.
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n/a, "Enhanced Stiffener Design for BGA Devices", Technical Disclosure Commons, (July 25, 2022)