This disclosure describes techniques for improved thermal management of memory modules. An extended surface with fins is mounted directly on the PCB prior to the memory module deployment within dedicated slots. The extended surface enables increased heat transfer rates and better thermal management. Sliding thermal interface material (TIM) is pre-installed on the extended surfaces to enable easy DIMM deployment and serviceability. Fin density and total area of extended surfaces can be customized based on the specific use case. The extended surfaces can be made of solid conductors. Optionally, thin heatpipes or vapor chambers can be embedded in the extended surfaces for enhanced cooling and to provide uniform cooling across different memory modules. Passive configurations that utilize natural convection-based airflow and/or active configurations with dedicated fans and baffle(s) can be utilized. Utilization of extended surfaces can enable lower attained maximum temperatures for memory modules.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.