Multi-dice modules can be assembled on a package substrate with high precision and small dimensions, e.g., in micrometers. The package substrate may be a traditional organic substrate, or an advanced substrate such as a silicon interposer, silicon bridge, or 3D silicon stack. Once a multi-die module is assembled, certain edges of an individual die become difficult to access due to their close proximity to other dice. This disclosure describes techniques to address input/output (IO) port access in multi-die modules by utilizing other dice in the module as proxy IOs for a die with limited pin access. Input test patterns and output test results for a die-under-test with inaccessible ports are routed through another die with accessible ports and with lines of communication with the die-under-test.

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