Abstract
This disclosure describes techniques for the mitigation of voids during a direct soldering process whereby a cooling component is soldered to a chip or processor (silicon). Per techniques of this disclosure, mechanical vibration or non-contact vibration is applied to the cooling component-silicon assembly during the soldering process to help disperse solder and eliminate voids or open areas. In some implementations, direct mechanical vibration is applied to the assembly during the soldering process by utilizing a vibrating tray during the direct soldering process. Alternatively, or in addition, non-contact vibration is applied, e.g., by utilizing an ultrasonic or laser that excites the solder material surface during the direct soldering process. Techniques of this disclosure can provide improvement in the thermal interface and the contact between the cooling component and the silicon surface and help improve thermal performance.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
n/a, "Mitigation of Voids During Direct Soldering of Cooling Components to Silicon", Technical Disclosure Commons, (April 06, 2022)
https://www.tdcommons.org/dpubs_series/5045