This disclosure describes configurable immersion cooling systems that can be utilized for cooling high power as well as low power electronic components. The immersion cooling system is configured to utilize two-phase cooling for high power applications and single-phase cooling for low power applications. The configurable immersion cooling system utilizes the same immersion tank and dielectric operating fluid for low and high temperature applications. In one implementation, the immersion system is configured for the cooling of low power components by repositioning the heat exchanger such that the condenser tubes are in contact with the dielectric fluid. The dielectric fluid is sub-cooled to below its saturation temperature. Circulation of the dielectric fluid occurs via free convection. Additional thermal coupling can be provided between the heat exchanger condenser tubes and the dielectric fluid in the immersion tank to improve heat transfer efficiencies.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.