This disclosure describes layout modifications in PCBs to provide improved impact performance for wearable devices. Specifically, techniques described herein can be utilized to improve the mechanical performance of the PCB solder joint. Oversized inner layer pads are added that are connected to the surface layer pads with vias, which serve as rivets to anchor the surface pads down. The inner layer pads are held down by utilizing copper floods of the surface layer to further improve robustness. Thicker, redundant traces are added to the bottom surface layer as well as the inner layer. The described techniques can provide an in-ear wearable device that is more resilient and offers improved impact performance, e.g., works reliably even after being dropped.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.