An important bottleneck in heat transfer, and hence in the delivery of high performance computing, is the resistance at the chip-coolant junction. An on-chip diamond heat spreader (with high thermal conductivity) can potentially spread heat across the silicon and rapidly transfer heat to the heat sink. This disclosure describes techniques to provide diamond heat spreaders as tiles or mosaics pieced together over an underlying silicon chip. By thus implementing a diamond heat spreader in the form of tiles, the techniques leverage the excellent thermal properties of diamond while resolving the assembly and reliability issues that heretofore existed with it. The techniques are suitable for use in high performance silicon chips, e.g., used in artificial intelligence or machine learning applications.

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