This disclosure describes a molded copper (Cu) based vertically interconnected redistribution layer (RDL) bridge die package. Copper posts embedded within a mold compound substrate are utilized to provide vertical interconnections for an embedded die package. RDL bridges are then fabricated on the mold using an RDL process. The RDL bridge provides better signal and power integrity for High Bandwidth Memory (HBM) applications, while also providing added manufacturing flexibility and reduced costs by eliminating a need for through silicon vias (TSV). The molded bridge die packages can be configured for different use cases and can include embedded active or passive devices.
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N/A, "Molded Bridge Die Packages With Redistribution Layer Bridge", Technical Disclosure Commons, (July 23, 2021)