Inventor(s)

HP INCFollow

Abstract

We encounter hot air re‐circulation issue with thermal rear venting to convertible laptop with

stage hinge design. The hot air re‐circulation issue will result in thermal capacity reduction due

to hot air flow back. (as Pic. 1) No fresh cold air can get from the inlet. With those issues, heat

be generated from ICs (CPU/GPU…etc) can’t be removed successfully, this will also cause the

processor performance limitation which result in total system performance reduction.

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