This disclosure describes techniques for provision of additional airflow intake paths in computing devices such as laptops for improved thermal management performance. Per techniques of this disclosure, a path that enables use of the speaker holes for air intake is provided, thereby increasing the airflow. Speaker holes in a laptop that are otherwise unused are utilized as additional air intake paths that can decrease airflow resistance and increase an airflow rate within a thermal management system. Increased airflow rate within the device can enable utilization of smaller and quieter fans and maintenance of cooler temperatures.
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Cooper, James and Saini, Vivek, "Utilization of Unused Speaker Holes for Improved Thermal Management in a Laptop", Technical Disclosure Commons, (July 01, 2021)