This disclosure describes techniques for the routing of interconnects in computing devices such as laptops for improved thermal management performance. Per techniques of this disclosure, the interconnects are positioned in the same horizontal plane as the heat sink (fins) such that they do not block airflow at a fan's outlet. The placement is such that they do not occupy additional horizontal space, leading to a reduced airflow path length. In various implementations, the interconnect can be placed above or below the fins or heatpipe, or in a notch provided in an enclosure of the device. In some implementations, an additional element, e.g., antenna is stacked with the cable/flex. The thickness of the interconnect can be further reduced by making the heatpipe the carrier for the heatpipe and using the heatpipe to transmit the ground lines of the flex or the antenna.
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Cooper, James and Saini, Vivek, "Routing of Interconnects for Improved Thermal Management in a Laptop", Technical Disclosure Commons, (July 01, 2021)