This disclosure describes the use of a polygon-shaped (polygonal) interconnect bridge for connecting chips within an electronic package. The polygon-shaped interconnect bridge can be made of film, silicon, or a combination of film and silicon structures. The polygon-shaped bridge can be customized to follow an outline perimeter of included chips and wiring and enables stacking of high performance chips. The polygon-shaped interconnect bridge enables avoidance of interconnect bridge overlap (collision) without any modifications to the floorplan, thereby providing cost and performance benefits. The interconnect bridge can be formed by sequential photo-patterning of multiple bridge layers. A boundary line is additionally photo-patterned for easy separation and release of the interconnect bridges from a main silicon wafer when all layers are completely formed. Polygonal interconnect bridges that include through silicon vias are singulated using backgrinding and plasma etching.

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