Min Zhu
Junnan Lin


Hardware components can experience failures, such as component shorts, during different manufacturing stages as well as in the field once such products are deployed. Presented herein is a new component conscious thermal imaging system that can increase hardware debug effectiveness for determining component failures related to thermal events. In one instance, the system can be used during manufacturing in order to setup a component thermal database that can be used to identify thermal related quality events in the early stages of component manufacturing. In another instance, the system can be used in the field to debug component failures for deployed products.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.