Inventor(s)

HP INCFollow

Abstract

This idea is by hinge design and adjustable process to change module performance for different NB

product request. Keep same material and assembly process and only need to dispense glue position to

change click performance. This method can leverage same design and material for different NB product

then achieve material and facility process cost saving.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution-Share Alike 4.0 License.

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