Techniques for the cutting of waveguides from patterned glass wafers are described. Translation of an ultrafast laser beam across a wafer is performed to mark the wafer by forming a filament curtain that is aligned to the waveguide edge profile. Chucks are used to secure the wafer during marking and subsequent separation of the waveguides. The chucks include vacuum ports placed at selected locations for debris control around the cut edges. After marking, thermal shock is induced by CO2 laser absorption for breakage along the filament curtain and waveguide separation (singulation). An optical imaging system is used to calibrate the positional alignment of cutting profiles to the patterned wafer.

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Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.