The trends of increasing transistor density and computational load have converged to create very high temperatures at integrated circuits (IC). Water cooling has been introduced as a heat-dissipation technique for ICs with heavy thermal load. However, just as for air-cooling, water-cooling works optimally when there is adequate contact area between the flowing coolant and the heat source (the IC). This disclosure describes techniques to enhance the heat dissipated during water cooling of ICs using an array of metallic wires bonded at right angles to the IC package at one end and to a metallic manifold at the other end. The manifold and the package form a channel into which cold water is pumped in and hot water exits. Wire bonding, a robust technique originally developed to establish electrical coupling, is repurposed to enhance direct liquid cooling via increased contact area.

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This work is licensed under a Creative Commons Attribution 4.0 License.