High-performance cooling solutions that handle high-density electronics work optimally when the semiconductor package is lidless, e.g., when the silicon of the package is exposed to the coolant on the back (or top) side of the package. However, lidless packages suffer from warpage which can lead to device malfunction. This disclosure describes techniques for controlling the warping of semiconductor packages. A scaffolding made of steel (or other suitable material) is mechanically affixed to a stiffener ring during fabrication to ensure stiffness of the package. Alternatively, the package is pre-bent at room temperature such that it flattens at operating temperature. The scaffolding and pre-bending apparatus are removed after surface mounting, such that, during operation, the chip is exposed to heat-dissipation elements, e.g., coolants, heat sink, cold plate, etc.

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This work is licensed under a Creative Commons Attribution 4.0 License.