This disclosure describes an electroplating configuration that is resistant to electrolytic corrosion. The configuration is a stack-up of different layers that include copper (Cu) layer surrounding the substrate, a nickel (Ni) layer, and a nickel-tungsten (NiW) layer. The configuration additionally includes a gold (Au) layer utilized as an interface layer between the NiW layer and an outer rhodium-ruthenium (RhRu) layer. To impart electrolytic corrosion resistance, a rhodium-ruthenium (RhRu) layer is electroplated as an outer layer. The electroplating stack-up described in this disclosure has significantly improved anti-electrochemical corrosion capability than prior techniques.

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This work is licensed under a Creative Commons Attribution 4.0 License.