Heatsinks are deployed within electronic devices to enable heat transfer from components such as microprocessors. This disclosure describes a two-stage heat spreading heatsink. The heatsink includes a first stage vapor chamber positioned at the base of the heatsink and a second stage of heat pipes positioned above and in contact with the vapor chamber. The vapor chamber is effective to spread (transfer) heat away from the chip (or other heat generating component) and prevents localized heat buildup on the surface of the chip. The heatpipes are effective to transfer the heat from the vapor chamber and into air cooled fins. The two-stage heat spreading heatsink described in this disclosure offers superior thermal performance for air cooling.

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Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.