Abstract
When multiple heatsinks are placed side-by-side on a motherboard, air tends to bypass the heatsinks and flows through the gaps between the heatsinks, thereby reducing heatsink efficacy. To combat the bypassing of air, foam is used to seal gaps between the heatsinks. However, the adhesive of the foam degrades with time, causing the foam to fly off and damage the fan blades. This disclosure describes heatsinks with interlocking edge fins that are perpendicular to the direction of airflow. When two such heatsinks are placed side-by-side, their edge fins interlock, forming a labyrinth seal that reliably prevents airflow bypass. Airflow occurs in an optimal direction, e.g., through fins of the heatsinks that are parallel to airflow, resulting in better heatsink thermal performance.
Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.
Recommended Citation
N/A, "Heatsink with reduced airflow bypass", Technical Disclosure Commons, (December 13, 2019)
https://www.tdcommons.org/dpubs_series/2763