This publication describes techniques and apparatuses that decrease the temperature variation in a cavity created by an interposer that stacks two or more boards inside a smartphone. When operating electrical components, heat generation is inevitable. A way to minimize temperature variation is by embracing and managing a safe rise in temperature in and/or around the electrical components inside the cavity of the interposer. A safe rise in temperature may be a temperature between +25°C and +85°C (e.g., +55°C). That way, when the smartphone shifts from an idle state to normal operation, the cavity of the interposer and the electrical components inside the cavity do not experience a large temperature variation—the cavity is pre-warmed. Less temperature variation enables the smartphone to use less complex software and lookup tables that are limited to one temperature (e.g., +55°C) instead of a wide range of temperatures, such as from -40°C to +85°C. Limiting temperature variation by keeping the cavity of the interposer above room temperature and below the maximum temperature offers consistent smartphone performance, better space utilization, and decreased manufacturing and/or operational cost.
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Korphi, Sean and Ghajar, Reza, "Temperature Controlled Stacked Board Cavity", Technical Disclosure Commons, (November 13, 2019)