The heat dissipated panel stress absorber is a ring structure with bumper on the back. The ring provides
cushion and heat spreading function, which can absorb the stress from external impact and spread the
heat rapidly generated from CPU, PCB, and other electronic components. It is different from an ordinary
process like using a tape or glue. Instead, the heat dissipated stress absorber is injected in the mold of
Mg alloy frame.
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INC, HP, "EFFECTIVE HEAT DISSIPATED PANEL STRESS ABSORBER ON Mg/Al ALLOY ENCLOSURE", Technical Disclosure Commons, (October 28, 2019)