HP INCFollow


The heat dissipated panel stress absorber is a ring structure with bumper on the back. The ring provides

cushion and heat spreading function, which can absorb the stress from external impact and spread the

heat rapidly generated from CPU, PCB, and other electronic components. It is different from an ordinary

process like using a tape or glue. Instead, the heat dissipated stress absorber is injected in the mold of

Mg alloy frame.

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