This publication describes systems and techniques directed to the use of discontiguous interposers to facilitate the stacking of multiple printed circuit boards (PCBs). In some aspects, an architecture of a subassembly of a system is described that uses the discontiguous interposers to stack multiple PCBs. The architecture is beneficial to heat transfer characteristics while accommodating electromagnetic shielding performance needs of the system. In other aspects, a manufacturing technique is described that panelizes the discontiguous interposers in a fashion that results in manufacturing efficiency gains.

Creative Commons License

Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 License.